TAB Bonding Machine, Product: TM-300PR-MKIII

Home

English

Sitemap

	-

FOG Automatic Bonding Machine

All Products

	ACF / HSC Bonding Machine

Pulse Heat Machine
TM-101P-MKIII

Pulse Heat Machine
TM-101PR-MKIII

	ACF Pre-attachment Machine

ACF Pre-attachment Machine
TM-90-MKIII

ACF Pre-attachment Machine
TM-90-MKIII-1

	Reflow (Hot Bar) Soldering Machine

Reflow (Hot Bar) Soldering Machine TM-111-MKIII

	Semi-Auto COG/COF Bonding Machine

Semi-Automatic
COG Pre-bond Machine TM-807C

COG Final Bond Machine TM-808P

	Pulse Heat TAB Rework Machine

TM-118P-TFT

	TAB Bonding Machine

TAB Bonding Machine
TM-300PR-MKIII

	Electronic Manufacturing Equipment

Spot Weld Machine TM-333

	Test & Measurement Equipment

Precision Pull Tester TM-78

LVDT Readout Controller TM-28S

1 Channel Load Cell Controller
TM-29S

Temperature Data Logger
TM-22

	Flex On Glass Bonding Machine

TM-300C-2H-MKIV

	FOG Automatic Bonding Machine

TM-388P

Flex On Glass Bonding Machine

For Product Enquiry

Flex On Glass Bonding Machine TM-300C-2H-MKIV

FOG Bonding Machine, TM-300C-2H-MKIV is specially designed for FOG, TAB Bonding applications. The equipment is integrated with Pre-bond and final bond modules. Pre-bond module is integrated to ensure substrate is aligned before final bonding process. Constant heat is utilized as the heating source to ensure consistency in the temperature across the heater block. Dual worktables that operate in Left-Right movement allows user to align the substrates at pre-align station located in the centre while final bonding process takes place in the Right/ Left station.

	Specifications Chart
	Print This Page
	Download Brochure [Size=670KB]
[ Note: It may take a few minutes for downloading, please wait. ]

TM-300C-2H-MKIV
Flex On Glass Bonding Machine


Key Features & Benefits

	Capable of TAB or FPC Bonding onto LCD panel			Electronics pressure control for precision final bonding force output
	Utilisation of constant heating for Final bond process			Leveling mechanism adjustment on press assembly
	Dual bonding pressure (for Final bonding)			Option of Auto or Manual process mode for machine set-up
	Backup head with additional heating capability			Unlimited programmable profiles can be stored electronically depending on capacity
	2 Bottom vision CCD camera system			LCD touch screen controller for easy parameter settings and recall
	Bilingual language selection			User pre-set password


Applications

FOG Bonding, TAB Bonding to LCD

Specifications Chart

Power Requirement	220VAC±10% Free from momentary surge and failure
Supply Pressure	Filtered clean air, 5-7 kgf / cm²
Visual Aid	2 units of colour CCD system
Parameter Setting	1 units of LCD touch panel (parameter settings for Pre-bond and final bond)
LCD Work Table size	200mm (L) x 160mm (W)
Work Table Type	Linear (Left to Right)
Dimension	1269mm (L) x 711.5mm (W) x 1510mm (H) w/o tower light
Weight	Approx. 413kg
Bonding Accuracy	X: ± 10µm Y: ± 30µm

Pre-Bond Process
Heating Method	Constant Heat
Hold Temp	30ºC to 200ºC
Preset Hold Temp	0.1 to 25 secs
Heater Block Specifications
Bonding Force	1kgf – 12kgf
Max. Heater Block size	50mm x 2mm

Final Bond Process
Heating Method	Constant Heat
Hold Temp (Top)	30ºC to 400ºC
Hold Temp (Bottom)	30ºC to 200ºC
Heater Block Specifications
Bonding Force	5kgf – 170kgf
Max. Heater Block size (Top)	160mm x 1.2mm
Max. Heater Block size (Bottom)	160mm x 1.2mm
Thermocouple Type	K Type

Specifications are subjected to change without prior notice