TAB Bonding Machine, Product: TM-300PR-MKIII

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TM-300C-2H-MKIV

	FOG Automatic Bonding Machine

TM-388P

FOG Automatic Bonding Machine

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FOG AUTOMATIC BONDING MACHINE TM-388P

TM-388P is designed for FOG (Flex on Glass) applications. The machine is integrated with ACF pre-attachment, auto alignment/pre-bond and final bond modules into a single system. Auto alignment/pre-bond module is integrated with FPC (COF/TAB) handling unit. TAB punching unit can be integrated into FPC handling unit as an upgrading option.

A substrate handling system incorporating loader/unloader and panel orientating mechanism ensures seamless and fast operations.

The Final Bond units is equipped with Cherusal INTELLIPULSE system, which provides the advantages for rapid temperature ramping, reducing heat-sinking effect on substrate, cooling process (after bonding) and reduction in power consumption.

	Specifications Chart
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TM-388P
FOG Automatic Bonding Machine


Key Features & Benefits

	Pulse heated final bond stations equipped with INTELLIPULSE system
	Substrate handling system for fast and cotinuous processes
	High speed auto alignment system
	FPC handling unit transfers flex direct to Alignment/Pre-bond module
	For LCD panel sizes ranging from 1" to 6"


Applications

Precision bonding of TAB or FPC to glass panel

Specifications Chart

Utility
Power Supply	1 phase, 208V ± 10V, 50/60 Hz
Compressed air supply	Pressure 5kg/cm² {regulator install at input side}
Vacuum supply	1. Utility vacuum supply - 600mm/Hg 2. Vacuum pump installed (facility source & pump source switch value)
Air inlet	1µm filter & regulator installed
Air consumption rate	280l/min
Product Specification
LCD panel	1" - 6"
Machine Specification
Machine dimension	4300mm (L) x 1750mm (W) x 220mm (H) - With Tower Light
Machine weight	Approx. 2000kg
Vision System Unit
Color Camera	¼ CCD Camera
Field of View	3.5mm x 2mm
Optical Magnification	100 Magnification
Top and Bottom ACF Dispensing
Heating Method	Constant Heat
Bonding Force	3.5kgf - 70kgf
Hold Temperature	RT - 300ºC
Hold Period	0.1sec - 25sec
ACF Cutting Method	Half Cut
ACF Indexing Accuracy	±0.2mm
Pre-Bond Station
Heating Method	Constant Heat
Pre-bond Temperature	150ºC
Pre-bonding Accuracy	±7µm
Final Bond Station (Top and Bottom)
Heating Method	Pulse Heat
Bonding Force	3.5kgf - 70kgf
Temperature Ramp Profile	04 Stages
Ramp Period (1st to 4th)	RT - 450ºC
Bonding Accuracy	±10µm;

Specifications are subjected to change without prior notice