provides solutions for bonding and soldering various electronics components onto PCB and LCD. Flexible circuit, flexible connectors and TAB can be "HOT-BAR" onto any solderable substrates vis integrated systems with pulse heat controllers.

Pulse heat controllers features the latest technology in heating, which provides spontaneous heating and cooling. The MARK II controllers are upgraded with more value added features such as real time temperature profile charting, dual ramp temperature profile, user friendly programming, etc.

controllers come in modular design that permits flexible integration into systems for a wide range of applications like Heat-sealing, ACF (Anisotropic Conductive Film) Bonding, Reflow Soldering of TAB and COG (Chip on Glass) Bonding for LCD modules manufacturing. Other applications that requires precision heating such as eutectic die bonding can also make use of our state of art controllers as a source for monitoring the heating process.

also offers other equipment that supports TAB Bonding and COG Bonding process. Single or multiple ACF dispensing onto LCD and TAB Pre-bonding are processes that are required prior to the actual bonding processes.