Products

  • PULSE HEAT Controller
    TM-111-MKIV

    TM-111-MKIV pulse heat controller is designed specifically for reflow (hot bar) soldering of flex circuits, TAB and flexible flat connectors onto PCBs. This system uses pulse heat as a source of heating for accurate and consistent temperature control. Real time temperature profile is captured on the integrated LCD touch panel controller which also allows programming, storage and recall of parameter settings.

  • ACF半自动预附接机
    TM-90-3H-SA

    半自动ACF预附着机TM-90-3H-SA为ACF的自动层压设计直接将在同一时间三个FPC的。它非常适合在各向异性导电膜(ACF)的上液晶,玻璃面板,柔性电路,印刷电路板和各种基材的附着生产需要。装载和FPC的卸载可以手动(半自动模式)或外部转让武器(自动模式)来完成。恒定热被用作热源,以确保在横跨加热器块中的温度一致性。自动运行过程包括ACF层压,脱皮半切操作。这一高性能的ACF分配系统有能力处理单,双ACF保护层的能力。

  • ACF预附连机
    TM-90-MKIII
    TM-90-MKIII-R

    ACF的预附接机是非常适合于各向异性导电膜(ACF)的上液晶,玻璃面板,柔性电路,印刷电路板和各种基材的附着生产需要。恒定热被用作热源,以确保在横跨加热器块中的温度一致性。一般来说,ACF是预先连接到之前TAB或柔性电路粘结基材。自动运行过程包括ACF层压,脱皮半切操作。这一高性能的ACF分配系统有能力处理单,双ACF保护层的能力。集成普遍ACF夹头也与各种各样的ACF兼容。

  • FLEX对玻璃长条机
    TM-300P-MKIII-300

    专门设计用于玻璃粘结长柔性,TM-300PR-MKIII-300配备有高精度基于微处理器的脉冲热控制器,允许更好的温度控制和重复性所需长陀螺粘接过程。它能够接合柔性高达330毫米的长度。集成的Intelli-脉冲系统提供高速,使用方便,快捷准确的温度控制系统参数进行自动调整

  • 回流焊接机 TM-111-MKIII

    回流焊接机TM-111-MKIII是特别为热压连接 FPC,FFC和TAB于PCB及其他基体而设计的。此系统所引用的脉冲加热技术能让用户更精确的控制温度。其内置的LCD触控式屏幕能够提供即时温度曲线显示和快速的数据输入。TM-111-MKIII独有的Intelli-Pulse技术能根据系统参数提供快速和精确的控制温度。该款桌上型设备可提供固定\进出\左右以及旋转式的工作台选项。

  • AUTO PRE-TACK MACHINE

    TM-336-A

    Auto Pre-Tack Machine TM-336-A is designed for automatic alignment and pre-tacking of Flex onto Flex/PCB with PSA adhesive. All FPCs must be laminated with PSA prior to Flex alignment and pre-tack process. FPCs are loaded onto trays and transferred to the machine via conveyor belt.

  • ACF PRE-ATTACHMENT MACHINE

    TM-90-VA

    ACF Pre-attachment Machine TM-90-VA is designed for automatic pre-attachment of ACF onto the circuit board. The machine uses a press head to apply force and low temperature to let ACF pre-attach onto the circuit board or flexible circuit board. Pre-attachment of ACF is the first step in the process of ACF attachment.
    The machine uses the vision alignment system to align the ACF and then pre-attach ACF onto circuit board or flexible circuit board. Press head apply a constant heat to melt the ACF glue and apply a force to bond the ACF with printed circuit board or flexible circuit board together. The machine is operated fully automatically via the PLC control system. The press head generates heat via a heating rod.
    Machine Specifications is 230V ┬▒ 5%, 32 A / single-phase, current 50Hz ~ 60Hz.

  • FOF半自动决赛邦定机
    TM-103PR-3H-SA

    FOF半自动决赛邦定机TM-103PR-3H-SA是专为自动校准和FPC的最终结合到ACF层压FPC。 ACF的层叠FPC具有与ACF此对准和最终粘结过程之前被层叠。
    装载和FPC的卸载可以手动(半自动模式)或外部转让武器(自动模式)来完成。
    FOF半自动最终热压机TM-103PR-3H-SA配备Cherusal的Intelli-脉冲系统。智能影音脉冲系统提供高速的焊头精确的温度控制。共面性的机制的集成提供焊头让整个粘合区域甚至压力分布的调整。

Contact Information

    • Address:
      15 Tampines Industrial Avenue 5,
      T5@Tampines, Singapore 528763