Products

TRIMECH TECHNOLOGY > Thermal Bonding
  • ACF SEMI-AUTO PRE-ATTACHMENT MACHINE
    TM-90-3H-SA

    TM-90-3H-SA Semi-Auto ACF Pre-attachment Machine is designed for automatic lamination of ACF directly onto three FPCs at the same time. It is ideally suited for production needs in the attachment of Anisotropic Conductive Film (ACF) onto LCD, glass panel, flexible circuits, PCB and a wide variety of substrates. Loading and unloading of FPCs can be done manually (semi-auto mode) or by external transferring arms (auto mode). Constant heat is utilized as the heating source to ensure consistency in the temperature across the heater block. The automatic operation process comprises of ACF lamination,
    peeling and half-cut operation. This high performance ACF dispensing system has the ability to handle both single and double ACF protective layer.

  • PULSE HEAT MACHINE
    TM-101PR-MKIII
    TM-101P-MKIII

    Pulse Heat Machine is developed to perform a wide variety of joining applications such as ACF Bonding, HSC Bonding and TAB Soldering. The usage of pulse heating technology allows better temperature control and repeatability needed for better bonding quality. The systems are incorporated with Intelli-Pulse system that offers fast and accurate temperature control with easy usage as system parameters are
    automatically adjusted.

  • ACF PRE-ATTACHMENT MACHINE
    TM-90-MKIII
    TM-90-MKIII-R

    The ACF Pre-attachment Machine is ideally suited for production needs in the attachment of Anisotropic Conductive Film (ACF) onto LCD, glass panel, flexible circuits, PCB and a wide variety of substrates. Constant heat is utilized as the heating source to ensure consistency in the temperature across the heater block. Generally, ACF is pre-attached onto the substrates prior to bonding of TAB or Flex circuits. The automatic operation process comprises of ACF lamination, peeling and half-cut operation. This high performance ACF dispensing system has the ability to handle both single and double ACF protective layer. The integrated universal ACF collet is also compatible with a wide variety of ACF.

  • FLEX ON GLASS LONG BAR MACHINE
    TM-300P-MKIII-300

    Specifically designed for long flex on glass Bonding, TM-300PR-MKIII-300 is equipped with a high accuracy microprocessor based pulse heat controller that allows better temperature control and repeatability needed for Long FOG Bonding process. It is able to bond flex up to a length of 330mm. The integrated Intelli-Pulse system offers high speed and accurate temperature control with easy usage as system parameters are automatically adjusted

  • REFLOW LOW (HOT BAR) SOLDERING MACHINE
    TM-111-MKIII

    TM-111-MKIII Reflow (Hot Bar) Soldering Machine is designed specifically for reflow (hot bar) soldering of flex circuits, TAB and flexible flat connectors onto PCBs. This system uses pulse heat as a source of heating for accurate and consistent temperature control. Real time temperature profile is captured on the integrated LCD touch panel controller which also allows programming, storage and recall of parameter settings. The integrated Intelli-Pulse system offers high speed and accurate temperature control with easy usage as system parameters are automatically adjusted. This desktop system offers several options such as Left-Right, In-Out, Rotary and Stationary work tables.

  • AUTO PRE-TACK MACHINE

    TM-336-A

    Auto Pre-Tack Machine TM-336-A is designed for automatic alignment and pre-tacking of Flex onto Flex/PCB with PSA adhesive. All FPCs must be laminated with PSA prior to Flex alignment and pre-tack process. FPCs are loaded onto trays and transferred to the machine via conveyor belt.

  • ACF PRE-ATTACHMENT MACHINE

    TM-90-VA

    ACF Pre-attachment Machine TM-90-VA is designed for automatic pre-attachment of ACF onto the circuit board. The machine uses a press head to apply force and low temperature to let ACF pre-attach onto the circuit board or flexible circuit board. Pre-attachment of ACF is the first step in the process of ACF attachment.
    The machine uses the vision alignment system to align the ACF and then pre-attach ACF onto circuit board or flexible circuit board. Press head apply a constant heat to melt the ACF glue and apply a force to bond the ACF with printed circuit board or flexible circuit board together. The machine is operated fully automatically via the PLC control system. The press head generates heat via a heating rod.
    Machine Specifications is 230V ┬▒ 5%, 32 A / single-phase, current 50Hz ~ 60Hz.

  • FOF SEMI-AUTO FINAL BONDING MACHINE
    TM-103PR-3H-SA

    TM-103PR-3H-SA FOF Semi-Auto Final Bonding Machine is designed for automatic alignment and final bonding of FPC onto ACF laminated FPC. The ACF laminated FPC has to be laminated with ACF prior to this alignment and final bonding process.
    Loading and unloading of FPCs can be done manually (semi-auto mode) or by external transferring arms (auto mode).
    TM-103PR-3H-SA FOF Semi-Auto Final Bonding Machine is equipped with Cherusal Intelli-Pulse system. Intelli-Pulse system offers high speed and accurate temperature control on the bonding head. The integration of co-planarity mechanism provides adjustment of bonding head allowing even pressure distribution across the bond area.

  • AUTO FINAL BONDING MACHINE
    TM-808P-3H-A

    Specifically designed for Hot Bar (Reflow) Soldering, TM-100P-3H-XY is equipped with three bonding heads, allowing it to simultaneously bond three parts at a time. Each bond head is controlled by individual high accuracy microprocessor based pulse heat controller that allows excellent temperature control and repeatability needed for hot bar applications. The integrated Intelli-Pulse system offers high speed and accurate temperature control. The integration of co-planarity mechanism provides adjustment of bonding head allowing even pressure distribution across the bond area. The machine is equipped with servo motor actuated X, Y movement table to translating fixtures to multiple bond positions rapidly and accurately.

Contact Information

    • Address:
      15 Tampines Industrial Avenue 5,
      T5@Tampines, Singapore 528763
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