Auto Final Bonding Machine
TM-110P-8H-A Auto Final Bond Machine is designed for automatic final bonding Flex onto Flex/PCB. All Flexes must be pre-tacked onto Flex/PCB with PSA/TSA/ACF adhesive prior to final bonding.
The Final Bond units are equipped with Cherusal INTELLIPULSE system. This state of art pulse heated system automatically selects pulse current based on set temperature profile….,which provides the advantages for rapid temperature ramping, reducing heat-sinking effect on substrate, cooling process (after bonding) and reduction in power consumption.