Pulse
Heat Machine is capable of applications like HSC Bonding, ACF Bonding and TAB
Soldering. Such applications are widely use in electronic products like mobile
phones and computers.
Dispense various type of
Anisotropic Conductive Film (ACF) onto glass panels, flexible circuits, PCB and
other substrates is made easy with range
of ACF Pre-attachment Machine.
Reflow
(Hot Bar) Soldering Machine is designed specifically for reflow (hot bar)
soldering of flex circuits, TAB and flexible connectors onto PCB.
Suitable for a wide range of
substrates sizes including glass and flex substrates, range
of Semi-automatic COG/COF Bonding is able to auto align IC to substrates.
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Pulse
Heat Machine is capable of applications like HSC Bonding, ACF Bonding and TAB
Soldering. Such applications are widely use in electronic products like mobile
phones and computers.
New
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