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    Pulse Heat Machine is developed to perform a wide variety of joining applications such as ACF Bonding, HSC Bonding and TAB Soldering. The usage of pulse heating technology allows better temperature control and repeatability needed for better bonding quality. The systems are incorporated with Intelli-Pulse system that offers fast and accurate temperature control with easy usage as system parameters are
    automatically adjusted.


    • Cylinder design to be low force from 1kgf to 18kgf (can be customize depending on force requirement)
    • Microprocessor based pulse heat controller offers fast heating and cooling
    • 4 stage ramp temperature
    • Intelli-Pulse system offers fast and accurate temperature control as system parameters are automatically adjusted
    • Real time temperature profile display on LCD touch panel
    • Interchangeable Silicone Rubber and polyamide tape
      indexing mechanism
    • Colour or B/W CCTV Vision System for fine pitch alignment
    • Leveling mechanism for co-planarity adjustment
    • Electronic pressure control with digital display
    • Manual mode for machine set-up
    • Dual thermocouple ensures over temperature protection
    • 20 programmable profiles can be stored electronically
    • LCD touch screen controller for programming, storing and recalling parameter settings
    • User pre-set password


    • ACF Bonding for Flex to PCB
    • Hot Bar Soldering of Flex, TAB & FFC
    • Heat Sealing to PCB/LCD
    • TAB Bonding

Contact Information

    • Address:
      15 Tampines Industrial Avenue 5,
      T5@Tampines, Singapore 528763