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TRIMECH TECHNOLOGY > Thermal Bonding > PULSE HEAT MACHINE TM-100PR-SF

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  • PULSE HEAT MACHINE
    TM-100PR-SF

    Pulse Heat Machine is developed to perform a wide variety of joining applications such as ACF Bonding, HSC Bonding and TAB Soldering. The usage of pulse heating technology allows better temperature control and repeatability needed for better bonding quality. The systems are incorporated with Intelli-Pulse system that offers fast and accurate temperature control with easy usage as system parameters are
    automatically adjusted.

    FEATURES & BENEFITS

    • Motorize with load cell design with the lowest force application ( 0.1 kgf to 4 kgf )

    APPLICATION

    • ACF Bonding for Flex to PCB
    • Hot Bar Soldering of Flex, TAB & FFC
    • Heat Sealing to PCB/LCD
    • TAB Bonding

Contact Information

    • Address:
      15 Tampines Industrial Avenue 5,
      T5@Tampines, Singapore 528763
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