TM-111-MKIII is designed specifically for hot bar soldering of flex circuits,
TAB and flexible connectors onto PCBs. The system uses pulse heat as a source
for heating, which is capable of spontaneous heating and cooling.
Other
features include 20 programmable profiles and a LCD touch
panel controller
.
23ºC +/-5ºC, 40 to 100% humidity with no significant
dust
Thermocouple Type
K Type
Supply Pressure
Filtered Clean and Dry Air, 5 - 7kgf/cm²
Program Capacity
20 Programs
Preset Start Temp
1st-4th ramp temp 30°C - 300°C
Password
User Preset
Preset Ramp Temp.
1st-4th ramp temp 30°C - 450°C
System Type
Table Top
Preset Release Temp.
1st-4th ramp temp 30°C - 450°C
Dimensions
700mm (L) x 600mm (W) x 588mm (H)
Bonding Force
1kgf - 40kgf
Work Table Size
180mm x 180mm
This system also features functions like co-planarity
adjustment mechanism and electronic pressure control for precision bonding
force output. TM-111-MKIII is a versatile tabletop system that offers users
with options such as left-right indexing bed or stationary/rotary bed. These
features help users boast productivity with easy and fast loading and unloading
of substrates. The soldering technique can be used for a wide range of
applications such as soldering of TAB, flex circuits and flexible connectors
onto PCB. Such technique is applicable to products such as mobile phones,
pagers and PDA where the PCBs are connected to the display.
Specifications are subjected to change without prior notice
Reflow
Soldering (Hot Bar) Machine
For
Product Enquiry
Specifications Chart