TAB Bonding Machine, Product: TM-300PR-MKIII

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Semi-Automatic TAB Bonding Machine TM-118P-TFT

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TM-118P-TFT Semi-Automatic TAB Bonding Machine (Bonding of TAB to TFT & PCB(PWB)

High performance Semi-Automstic TAB Bonding Machine TM-118P-TFT is specifically designed for bonding of TAB to LCD and PCD of TFT panels up to 10-23 inches. TM-118-TFT is also well suited for TAB rework applications. This system is able to perform soldering of TAB substrates to PCB. By changing the polyamide tape with a silicone rubber, the machine can be used to perform heat-sealing of Heat-seal connector and bonding of TAB to LCD panels.

	Specifications Chart			Print This Page
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TM-118P-TFT
Semi-Automatic TAB Bonding Machine


Key Features & Benefits

	Microprocessor based pulse heat controller			Color CCD camera for fine pitch alignment
	Light source for CCD camera			40 programmables profiles
	User pre-test password


Application

Ability to perform TAB Bonding and Hot Bar Soldering of TAB to TFT and PCB (PWB)

Suitable for large TFT panels measuring at 10-23 inches

Specifications Chart

Heating Method	Pulse Heat	Pulse Heat Specifications
Power Requirement	230VAC +/-10%, 50/60 Hz, 3.5kVA	Bonding Force	4kgf - 72kgf
Operating Ambient	10-40ºC, 40 to 100% humidity with no significant dustFiltered	Temperature Ramp Profile	2 Stages
Supply Pressure	Filtered Clean and Dry Air,5 - 7kgf/cm²	Start Temp.	30ºC to 300ºC
Visual Aids	2 units of colour CCD (at bottom) 2 units of colour CCD (at top)	Ramp Temp.	30ºC to 400ºC
Work Table Size	650mm x 650mm	Ramp Period.	1 to 25 seconds
Monitors	10.4" TFT monitors	Hold Period.	1 to 100 seconds
LCD Size	10" to 23"	Release Temp	30ºC to 400ºC
PCB Size	X:90mm xY:10mm ~X:530mm xY:100mm	Thermode Specification
Indexing	Selectable 15 position for bonding	Max. Thermode Size	65mm x 2mm
User Interface	LCD Touch Panel	Thermocouple Type	K Type
Programmable Profiles	40
Dimensions	1900mm(L) x 1250mm(W) x 1683mm(H)
Weight	Approx. 900kg

Specifications are subjected to change without prior notice