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 TAB Bonding Machine
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TM-300PR-MKIII TAB Bonding Machine

Specifically designed for fine pitch TAB Bonding, TM-300PR-MKIII TAB Bonding Machine is equipped with an ergonomically designed bottom vision camera system capable of fine pitch alignment and allows you to enhance ITO and TAB conductive lines clarity. The utilization of pulse heat technology allows better temperature control and repeatability needed for fine pitch TAB Bonding process. The integrated Intelli-Pulse system offer accurate temperature control as the parameter settings are automatically adjusted.

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TAB bonding
TM-300PR-MKIII
TAB Bonding Machine
Key Features & Benefits

High accuracy microprocessor based pulse heat controller

Manual mode for machine set-up
Bottom view camera system for fine pitch applications Storage up to 20 programmable profiles
Accurate co-planarity adjustment mechanism LCD touch panel controller
4 stage ramp temperature Built-in security password system
Intelli-Pulse system offer accurate temperature control as the parameter settings are automatically adjusted Customisation available
Over temperature protection    
       
Application

ACF Bonding for TAB to LCD

ACF Bonding for Flex Printed Circuit to LCD

Specifications Chart

Heating Method Pulse Heat Bonding Force 3.4Kgf - 71Kgf
Power Requirement 220Vac 100% Free from momentary surge and failure Max. Thermode Size 75mm x 2mm
Supply Pressure Filtered clean air, 5-7 kgf / cm² Thermocouple Type K Type
Preset Start Temp. 30ºC to 300ºC Visual Aids 2 sets of B/W CCTV below
Preset Ramp Temp 1st - 4th Ramp Temp., 30ºC to 450ºC Work Table Size 120mm x 120mm
Preset Hold Period 1st - 4th Hold Period, 1 to 100 seconds Work Area 420mm x 420mm
Ramp Period 1st - 4th Ramp Period, 1 to 25 seconds Dimensions 800mm (L) x 800mm (W) x 1430mm (H)
Preset Release Temp 30ºC to 450ºC Weight Approx. 300kg

Specifications are subjected to change without prior notice
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