Semi-Automatic COG Bonding Machine, Product:TM-607C

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Semi-Automatic COG Bonding Machine

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Semi-Automatic COG Bonding Machine

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TM-607C Semi-Automatic COG Bonding Machine

TM-607C Semi Automatic COG Bonding Machine utilises Constant Heat to perform IC Pre Bond and Final Bond operation. This system is designed for bonding IC onto a wide range of substrates with ACF already pre-attached. The integrated Constant Heat Controller ensures the temperature consistency of the system for better control and accuracy.

	Specifications Chart	COG Process Chart
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TM-607C Semi-Automatic COG Bonding Machine

Other Model»
TM-607P (integrated with Pulse Heat Controller)


Key Features & Benefits

	Microprocessor based Pulse Heat Controller ensures temperature consistency			Automatic IC handling Station
	Ability to perform 2 functions : COG Pre-Bond and Final Bond Stage			Suitable for a wide range of substrates
	Semi Automatic Operation


Application

Bonding IC onto a wide range of substrates with ACF pre-attached

Specifications Chart

Power Requirement		Single Phase, 220-240VAC, 50 Hz, 3kVA	Substrates Dimensions	20mm x 20mm – 120mm x 100mm
Operating Ambient		23ºc +/-5ºc, 40 to 100% humidity, controlled environment	No. of IC Tray	10 (2 inches IC) 3 (3 inches IC)
Pre Bond	Heating Method	Constant Heat	Chip Supply Direction	IC face down
	Pre-Bond Temp.	150ºc (max)
Final-Bond	Heating Method	Constant Heat	Alignment Accuracy	±5µm
	Final-Bond Temp.	350ºc (max)
Supply Pressure		Filtered Clean and Dry Air, 6kgf/cm² (min)	Dimensions	1050mm(L) x 1000mm(W) x 1650mm (H)
Bonding Force		2Kgf – 29Kgf
Chip Dimensions		3mm x 1mm – 25mm x 5mm	Weight	Approx.500kg

Specifications are subjected to change without prior notice