Semi-automatic COG/COF Bonding Machine, Product:TM-608

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COG / COF Bonding Machine

Semi-Auto COG/COF Bonding Machine

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TM-608 Semi-automatic COG/COF Bonding Machine

TM-608 Semi-automatic COG/COF Bonding Machine is capable of performing all 3 functions - ACF Pre-attachment, IC Pre Bond and Final Bond operation.

The machine is equipped with an automatic IC handling station that is able to align IC to substrates. Integrated with Pulse Heat Controller, this system is suitable for a wide range of substrate sizes including glass and flex substrates.

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TM-608 Semi-automatic COG/COF Bonding Machine


Key Features & Benefits

	Integrated Pulse Heat Controller offers better temperature control			Suitable for a wide range of substrates size
	Versatile system that incorporates 3 functions : ACF Pre-attachment, IC Pre-Bond and Final Bond Stage			User friendly programming
	Automated alignment of IC to substrates


Application

Applicable to Glass and Flex substrates and a wide range of substrate sizes

Specifications Chart

Power Requirement		Single Phase, 220VAC+/-10%, 50/60 Hz, 5kVA	Chip Dimensions	3mm x 1mm – 20mm x 5mm
Operating Ambient		23ºC +/-5ºC, 40 to 100% humidity, controlled environment	Substrates Dimensions	20mm x 20mm – 120mm x 100mm
Final-Bond	Heating Method	Pulse Heat	No. of IC Tray	4
	Bond Temp.	350ºc (max)
ACF Pre-attach	Heating Method	Constant Heat	Chip Supply Direction	IC face down
	Pre-attach Temp.	200ºc (max)
Pre Bond	Heating Method	Constant Heat	Alignment Accuracy	5µm
	Pre-Bond Temp.	200ºc (max)
Supply Pressure		Filtered Clean and Dry Air, 6kgf/cm² (min)	Dimensions	1800mm(L) x 1430mm(W) x 2350mm(H)
Bonding Force		2Kgf – 25Kgf	Weight	Approx.400kg

Specifications are subjected to change without prior notice