Semi-automatic COG/COF Bonding Machine, Product:TM-807C

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Semi-Auto COG Pre-bond Machine

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TM-807C Semi-Automatic COG Pre-bond Machine

Semi-automatic COG Pre-bonding Machine TM-807C is specifically designed for pre-bonding a wide array of IC to LCD panels. TM-807C offers several variation in handling IC and LCD. Alignment, placement of IC and pre-bonding process can be completed in a fully automatic operation with only loading & unloading of substrates done manually by operators. The machine can be activated using the ergonomically designed Optical Touch Button.

This system is integrated with Constant Heat Controller for repeatable and accurate temperature control. It is equipped with a unique Frame Grabber Vision system and magnified to 400X enabling automatic alignment of IC to LCD.

	Specifications Chart	COG Process Chart
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	Technical Writeup	Download Brochure [Size=223KB]
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TM-807C Semi-Automatic COG Pre-bond Machine


Key Features & Benefits

	Maximum productivity can be achieved with the integrated Dual Pre-bonding head that allows up to 2 substrates to be loaded each time			LCD touch panel for parameter settings and real time display of IC alignment images
	Automatic program pick-up of IC			Co-planarity Adjustment Mechanism
	·Automatic IC X/Y Orientation Mechanism			Unique Frame Grabber System for alignment
	Ability to handle IC and substrates of various sizes


Application

Applicable to Glass and Flex substrates and a wide range of substrate sizes

Specifications Chart

Machine Specification
Power Supply		Single Phase, 230V ± 10%, 50Hz/60Hz, 2KVA	User Interface	17" TFT Touch Panel
Operating Ambient		23 ± 5˚C, 40% ~ 100% Humidity, Controlled Environment	Vacuum Source	Vacuum Ejector - 84kPa x 4 No.
Control System		Embedded System 17" LCD Touch Screen Controller	Machine Weight	Approx. 1000kg
Machine Dimension		1300mm (L) x 1000mm (W) x 1510mm (H) Height: 1810mm (inclusive of tower light)
Pre-bond Specification
Pre-bond	Heating Method	Contant Heat	Pressure Control	Manual Precision Regulator with Pressure Gauge
	Pre-bond Temp.	150°C (max)
	Pre-bond Period	1sec ~ 20sec
Air Pressure Supply		Filtered Clean and Dry Air, 6Kg/cm²	Pre-bonding Force	0.5kgf ~ 12kgf (± 0.1kgf)
Pre-bonding Accuracy		± 3µm
Heater Block Specification
Heater Block Dimensions		26mm x 5.5mm	Heating Source	Heater Cartridge
Heater Block Material		Tool Steel Hardened to HRC 52	Thermocouple Type	K Type
Heater Block Flatness		± 1µm
Vision Systems Specification
Camera System		Hi-resolution USB Camera	Lens	Hi-resolution Tele-centric Lens
Light Source		Fiber Optics for Co-axial	Magnification	Approx. 400X
Vision System		1 unit of Camera System with Telecentric Lens	Alignment Method	Auto-alignment with Global Co-ordinates
Drive Method		X and Y Axis on Servo Motor
IC/Substrates Specification
IC Dimensions		3mm x 1mm x 0.4mm ~ 25mm x 5mm x 0.8mm	Substrate Dimensions	20mm x 20mm ~ 130mm x 200mm
Chip Supply Direction		IC Face Down	IC Orientation Mechanism	Servo Motor on Positioning Pockets
No. of IC Tray		8 Trays (2"x2" IC Trays)	4 Trays (2"x2" IC Trays) + 1 Tray (3"x3" IC Trays)
		2 Trays (4"x4" IC Trays)	4 Trays (2"x2" IC Trays) + 1 Tray (4"x4" IC Trays)
		2 Trays (3"x3" IC Trays)	2 Trays (2"x2" IC Trays) + 2 Trays (3"x3" IC Trays)
			1 Tray (3"x3" IC Trays) + 1 Tray (4"x4" IC Trays)

Specifications are subjected to change without prior notice