AUTO FINAL BONDING MACHINE
Specifically designed for Hot Bar (Reflow) Soldering, TM-100P-3H-XY is equipped with three bonding heads, allowing it to simultaneously bond three parts at a time. Each bond head is controlled by individual high accuracy microprocessor based pulse heat controller that allows excellent temperature control and repeatability needed for hot bar applications. The integrated Intelli-Pulse system offers high speed and accurate temperature control. The integration of co-planarity mechanism provides adjustment of bonding head allowing even pressure distribution across the bond area. The machine is equipped with servo motor actuated X, Y movement table to translating fixtures to multiple bond positions rapidly and accurately.