AUTO FINAL BONDING MACHINE
Specifically designed for Hot Bar (Reflow) Soldering, TM-100P-3H-XY is equipped with three bonding heads, allowing it to simultaneously bond three parts at a time. Each bond head is controlled by individual high accuracy microprocessor based pulse heat controller that allows excellent temperature control and repeatability needed for hot bar applications. The integrated Intelli-Pulse system offers high speed and accurate temperature control. The integration of co-planarity mechanism provides adjustment of bonding head allowing even pressure distribution across the bond area. The machine is equipped with servo motor actuated X, Y movement table to translating fixtures to multiple bond positions rapidly and accurately.
FEATURES & BENEFITS
- 3 Bonding Heads to bond 3 parts simultaneously
- 3 Top Bonding Heads to bond 3 parts simultaneously
- 3 Bottom Heater Module to preheat parts which has huge heat sink effect.
- Intelli-pulse system with 4 stage ramp temperature.
- Bonding force range of 1kgf ~ 28kgf.
- Bonding force repeatability +/-300g.
- Intelli-Pulse system offers fast and accurate temperature control +/-5 ⁰.
- Real time temperature profile display on LCD touch panel.
- 50 programmable profiles program storage.
- Hot Bar Soldering
- HSC Bonding
- ACF Bonding
error: Content is protected !!