COG Final Bond Machine, Product:TM-808P

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COG Final Bond Machine

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TM-808P COG Final Bond Machine

COG Final Bond Machine TM-808P provides the final-compression of pre-bonded COG modules. Integrated with Pulse Heat system, the Intelli-Pulse controller ensures precise and accurate temperature profile at any stage of the bonding process. Bonding pressure is controlled electronically for consistent output bonding force. All other considerations for bonding such as co-planarity adjustment and built vacuum are available in the machine to achieve good and reliable final bond quality.

	Specifications Chart	COG Process Chart
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TM-808P COG Final Bond Machine


Key Features & Benefits

	Semi-automatic Operation			Touch Panel User Interface with Real Time Temperature Profile
	Integrated withPulse Heat system			Co-planarity Adjustment Mechanism
	Intelli-Pulse controller			Manual Mode Function for machine set up
	Suitable for a wide range of substrates sizes			User Pre-set Password


Application

Applicable to Glass and Flex substrates and a wide range of substrate sizes

Specifications Chart

Machine Specification
Power Supply		Single Phase, 230V ± 10%, 50Hz/60Hz, 3.5KVA	Co-planarity Adjustment	Yes
Operating Ambient		23 ± 5˚C, 40% ~ 100% Humidity, Controlled Environment	Silicone or Teflon Rubber Indexing	Yes
Control System		Microprocessor Based	Real Time Temp. Display	Yes
Air Pressure Supply		Filtered Clean and Dry Air, 6Kg/cm²	Pressure Control	Electronics Pressure Regulator
User Interface		Touch Panel User Interface	Password	User Pre-set
Vacuum Source		Vacuum Ejector - 84kPa	Machine Weight	Approx. 250kg
Machine Dimension		420mm (L) x 700mm (W) x 1380mm (H)
Final Bond Specification
Final Bond	Heating Method	Pulse Heated	Bonding Force	1.5kgf ~ 44kgf
	Ramp Temp.	RT ~ 450°C (max)
	Ramp Period	1sec ~ 25sec
	Hold Period	1sec ~ 100sec
	Release Temp.	RT ~ 450°C
	Temp. Ramp Stage	4
Bonding Accuracy		≤ 3µm
Thermode Specification
Thermode Flatness		± 3µm (at room temperature)	Thermode Material	Hotvar
Thermocouple Type		K Type	Max. Thermode Dimensions	38mm x 6mm
IC/Substrates Specification
IC Dimension (max)		1mm x 3mm ~ 5mm x 25mm	Substrate Dimensions	20mm x 20mm ~ 130mm x 200mm
Loading Method		Front with Side Guide

Specifications are subjected to change without prior notice