TAB Bonding Machine, Product: TM-300PR-MKIII

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ACF Pre-attachment Machine

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ACF Pre-Attachment Machine

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ACF PRE-ATTACHMENT MACHINE TM-90-MKIII

TM-90-MKIII-1 ACF Pre-attachment Machine is ideally suited for production needs in the attachment of Anisotropic Conductive Film (ACF) onto LCD, glass panel, flexible circuits, PCB and a wide variety of substrates. Constant heat is utilized as the heating source to ensure consistency in the temperature across the heater block. Generally, ACF is preattached onto the substrates prior to bonding of TAB or Flex circuits. The automatic operation process comprises of ACF lamination, peeling and half-cut operation. This high performance ACF dispensing system has the ability to handle both single and double ACF protective layer. The integrated universal ACF collet is also compatible with a wide variety of ACF.

	Specifications Chart
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TM-90-MKIII
ACF Pre-attachment Machine


Key Features & Benefits

	Integrated with high accuracy constant heat controller			High performance system that handles single or double ACF protective layer
	Half-cut mechanism			Universal ACF collets and guides applicable to a wide variety of ACF
	Semi-automatic operation in linear moving stage provides fast and safe loading and unloading of substrates			Leveling mechanism adjustment on press assembly
	Built-in vacuum			Manual mode for machine set-up
	20 programmable profiles can be stored electronically			LCD touch screen controller for easy programming and parameter data storage and recall
	User pre-set password


Applications

Dispensing of ACF onto PCB, LCD and Flex Circuits

Specifications Chart

Heating Method	Constant Heat
Power Requirement	220VAC +/-10%, 50/60 Hz, 0.75kVA
Operating Ambient	23ºC +/-5ºC, 40 to 100% humidity with no significant dust
Supply Pressure	Filtered Clean and Dry air, 5-7 kgf / cm²
Programmable Profiles	20
Work Table Size	180mm x 180mm
Work Area	180mm x 180mm
LCD Panel Size	100mm (L) x 200mm (W)
Dimensions	600mm (L) x 600mm (W) x 1420mm (H)
Weight	Est. 110kg
Constant Heating Specifications
Hold Temp	30ºC to 300ºC
Hold Period	0.1 to 25 seconds at 0.05 seconds accuracy
ACF Delay to Peel	0 to 5 seconds
ACF Tape Advance	2mm to 80mm at 0.1 interval
ACF Width	1.5mm to 8mm
ACF Type	Single/ Double Protective Layer
ACF Cutting Method	Half Cut
ACF Placement Accuracy	X= +/-0.1mm, Y= +/-0.1mm
Heater Block Specifications
Bonding Force	2.0kgf – 48kgf
Heater Block Size	5mm x 1.5mm (min) to 80mm x 8mm (max)
Thermocouple Type	K Type

Specifications are subjected to change without prior notice