Machine specifications
- Power Supply: 220VAC +/- 10%, 50/60 Hz
- Power requirement: 4.5 KVA
- Compressed Air supply: Filtered Clean Air, 5-7bar
- Operating Ambient: 18-28 degrees, 40-100% humility, no significant dust
- Heating Method: Pulse heat
- Temperature Ramp Profile: 04 stages
- Start Temperature: 30°C ~ 300°C
- Ramp Period (1st to 4th Stage): 30°C ~ 450°C
- Release Temperature: 30°C ~ 450°C
- Bonding Head Movement: Cylinder
TM-100P
To meet basic requirements for thermo-compression applications for Hot Bar Soldering, ACF Bonding. Pulse Heat Machine TM-100P that is equipped with all required bonding functions provides the ideal solution for precision thermo-compression of FPC to PCB.