Machine specifications
- Controller unit: IPC
- Bonding head: 6
- Bonding Force: 0.5 kgf ~ 8 kgf
- Heating Method: Pulse heat
- Temperature Ramp Profile: 04 stages
- Start Temperature: 30°C ~ 300°C
- Ramp Period (1st to 4th Stage): 30°C ~ 450°C
- Release Temperature: 30°C ~ 450°C
- Real Time Temperature Profile: Yes
- Over Temperature Protection: Yes
- Thermode Size: Max. 25mm x 2mm
TM-809P-6H-A
TM-809P-6H-A, Auto Final Bond Machine, is designed for automatic final bonding Flex onto Flex/PCB. All FPCs must be pre-tacked onto Flex/PCB with PSA/TSA/ACF adhesive prior to final bonding. Bottom FPCs/PCBs in trays are delivered by incoming conveyor belt. Finished pre-tacked parts leaves the machine through conveyor belt in trays.