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Exhibition:Nepcon Malaysia 2008 Date:8~11 April 2008 Venue:Shanghai Everbright Convention & Exhibition Center

Trimech booth no. :2G34

Exhibition:Nepcon South China 2008 Date: 27~30 August 2008

Venue:Shenzhen Convention & Exhibition Centre, Hall 2 Trimech booth no.:2D61


range of Heat Bonding systems and LCD Module equipment is user- friendly, reliable and accurate and offer you advantages such as :

  • Shorter cycle time that helps to boost your productivity
  • Customisation of equipment
  • Password protected system
  • Easy set-up and management

Click here for more product information

Check out latest MKIV and MKIII Heat Bonding equipment



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