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Trimech achievement of ISO 9001:2000 certification

Visit Trimech’s booth at Nepcon/Microelectronics China 2007

Trimech will participate in Nepcon Thailand 2007

Come visit us at OPTO Taiwan 2007

See us at Nepcon SouthChina 2007


range of Heat Bonding systems and LCD Module equipment is user- friendly, reliable and accurate and offer you advantages such as :

  • Shorter cycle time that helps to boost your productivity
  • Customisation of equipment
  • Password protected system
  • Easy set-up and management

Click here for more product information

Check out latest MKIV and MKIII Heat Bonding equipment



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