Machine specifications
- Controller unit: PLC
- Operation Interface: Color display touch panel
- Emergency stop switch & grounding connect: Set up on machine unit
- Cycle time: From 16sec/pcs
- Heating method: Pulse heat
- Temperature ramp profile: 04 stages
- Start temperature: 30°C ~ 300°C
- Ramp period (1st to 4th stage): 30°C ~ 450°C
- Release temperature: 30°C ~ 450°C
- Machine size(L x W x H): 850mm x 920mm x 1664mm
- Machine Weight: Est.800kg
TM-100PR-SA
TM-100PR-SA FOB/FOF Semi-Auto Final Bonding Machine is designed for automatic alignment and final bonding of Flex directly onto PCB/Flex with ACF. PCB/Flex must be laminated with ACF prior to Flex alignment and final bonding process.