Machine specifications
- Substrate size: 7"(150mmx100mm) ~ 15.6"(360mmx260mm)
- Substrate Thickness (Top substrate): 0.5mm ~ 2.0mm
- Substrate Thickness (Bottom substrate): 0.5mm ~ 6.0mm
- Bottom Substrate Shape: 2" (55mm x 35mm) ~ 8" (200mm x 150mm)
- Flex & PCB: Must be flat, thickness evenness ≤ 40um; warpage ≤ 0.2 mm
- Auto Peeling Unit - Remove OCA Liner From Cover Glass
- Movement: Motorized X,Y, Z axis
- Peeling Method: Mechanical Clamp & Diagonal Peeling
- Clamping Mechanism: Vacuum linear corner, followed by clamp
TM-113
TM-113 Optical Clear Adhesive Lamination Machine is designed for Auto Linear Peeling for CG and Vacuum Lamination. The machine has the flexibility of laminating substrate sizes ranging from 7" to 15.6". Loading & Unloading substrates are done manually.