Machine specifications
- Substrate size: 2" to 8"
- Top Substrate: 2" (55mm x 35mm) ~ 8" (200mm x 150mm)
- Bottom Substrate: 2" (45mm x 25mm) ~ 8" (192mm x 140mm)
- Substrate Thickness (Top substrate): 0.2 mm ~ 2.0mm
- Substrate Thickness (Bottom substrate): 0.3 mm ~ 6.0mm
- Material specification: Glass,Plastic (Must be rigid)
- Substrate Shape: Must be flat, thickness evenness ≤ 40um;
- Substrate Warpage: Must be ≤ 40um
- Adhesive: PSA / OCA
- Substrate Holding Method: Vacuum (Optional Mechanical Clamps)
TM-38GL-2
TM-38GL-2 Machine is designed for attachment of Rigid to Rigid substrate. This dual station machine has the capability of attaching substrate size from 2" to 8". The machine comes with vision system which auto alignment both rigid substrates followed by vacuum lamination. Loading & Unloading substrates are done manually.