Machine specifications
- Controller unit: PLC
- Operation Interface: Color display touch panel
- Emergency stop switch & grounding connect: Set up on machine unit
- Cycle time: From 16sec/pcs
- Heating method: Pulse heat
- Temperature ramp profile: 04 stages
- Start temperature: 30°C ~ 300°C
- Ramp period (1st to 4th stage): 30°C ~ 450°C
- Release temperature: 30°C ~ 450°C
- Machine size(L x W x H): 850mm x 920mm x 1664mm
- Machine Weight: Est.800kg
TM-100PR-SA
TM-100PR-SA FOB / FOF半自动最终粘合机设计用于自动将Flex自动对准并最终粘合到带有ACF的PCB / Flex上。在Flex对准和最终粘合过程之前，必须将PCB / Flex与ACF层压在一起。