Machine specifications
- Substrate size: 7"(150mmx100mm) ~ 15.6"(360mmx260mm)
- Substrate Thickness (Top substrate): 0.5mm ~ 2.0mm
- Substrate Thickness (Bottom substrate): 0.5mm ~ 6.0mm
- Bottom Substrate Shape: 2" (55mm x 35mm) ~ 8" (200mm x 150mm)
- Flex & PCB: Must be flat, thickness evenness ≤ 40um; warpage ≤ 0.2 mm
- Auto Peeling Unit - Remove OCA Liner From Cover Glass
- Movement: Motorized X,Y, Z axis
- Peeling Method: Mechanical Clamp & Diagonal Peeling
- Clamping Mechanism: Vacuum linear corner, followed by clamp
TM-113
TM-113 OCA覆膜机设计用于CG和真空覆膜的自动线性剥离。该机器可以灵活地层压7“至15.6”范围的基材。基板的装卸是手动完成的。