Machine specifications
- Substrate size: 2" to 8"
- Top Substrate: 2" (55mm x 35mm) ~ 8" (200mm x 150mm)
- Bottom Substrate: 2" (45mm x 25mm) ~ 8" (192mm x 140mm)
- Substrate Thickness (Top substrate): 0.2 mm ~ 2.0mm
- Substrate Thickness (Bottom substrate): 0.3 mm ~ 6.0mm
- Material specification: Glass,Plastic (Must be rigid)
- Substrate Shape: Must be flat, thickness evenness ≤ 40um;
- Substrate Warpage: Must be ≤ 40um
- Adhesive: PSA / OCA
- Substrate Holding Method: Vacuum (Optional Mechanical Clamps)
TM-38GL-2
TM-38GL-2机器设计用于将刚性附着到刚性基材上。这台双工位机器可以粘贴2英寸至8英寸的基板尺寸。该机器配有视觉系统，该系统可以自动对齐两个刚性基材，然后进行真空层压。基板的装卸是手动完成的。